The assembly density is high, the volume of the electronic product is small and the weight is light. The volume and the weight of the patch component are only about 1/10 of the traditional plug-in components. Generally, after the SMT is adopted, the volume of the electronic product is reduced by 40% -60% and the weight is reduced by 60% 80%.
High reliability, strong seismic capacity. Solder joint defect rate is low.
Good high-frequency characteristics. Reduced electromagnetic and radio frequency interference.
Easy to automate and increase productivity. Reduce costs up to
30% ~ 50%. Save material, energy, equipment, manpower, time and so on.
Hangzhou NeoDen Technology Co.,Ltd
Add: Building 3,Diaoyu Industrial and Technology Park,No.8-2,Keji Avenue, Yuhang District, Hangzhou，China
Contact us: Steven Xiao
After-sales Support & Service