Categories

Contact Us

Hangzhou Neoden Technology Co.,Ltd


Steven Xiao

Call: 86-18167133317

Fax: 86-571-26266866

E-mail: steven@neodentech.com

SMT Placement Quality Process Development

- Aug 22, 2018 -


The development and progress of SMT process technology is mainly in four directions. The first is to adapt to the assembly requirements of the new surface-assembled components; the second is to adapt to the development of new assembly materials; the third is to adapt to the variety of modern electronic products, to update the fast features; the fourth is to assemble with high-density, three-dimensional The assembly requirements of new assembly forms such as assembly and MEMS assembly are compatible.


    Mainly reflect in:

    1. With the fine pitch of component leads, the micro-assembly technology of 0.3mm pitch is becoming mature, and is developing towards improving assembly quality and improving the pass rate of one assembly;


    2. With the popularity of the arrayed ball-type pin form at the bottom of the device, and the corresponding assembly process and testing, the rework technology has matured and is still being improved;


    3. In order to adapt to the development of green assembly and assembly process requirements after the introduction of new assembly materials such as lead-free solder, relevant process technology research is underway;


    4. In order to adapt to the multi-variety, small batch production and rapid update assembly requirements, assembly process rapid reorganization technology, assembly process optimization technology, assembly design and manufacturing integration technology is constantly being proposed and ongoing research.


Related Products