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Hangzhou Neoden Technology Co.,Ltd


Steven Xiao

Call: 86-18167133317

Fax: 86-571-26266866

E-mail: steven@neodentech.com

Quality Control During SMT PCB Assembly Manufacturing

- Aug 24, 2018 -

1, 1 quality process control point settings


The setting of the quality control is related to the production process. We can set the following quality control points during the machining process.


1) PCB incoming inspection


a. Whether the printed board has deformation; b. Whether the pad is oxidized; c, whether there is scratch on the surface of the printed board;


Inspection method: visual inspection according to the inspection standard.


2) Solder paste printing inspection


a. Whether the printing is complete; b. whether there is bridging; c. whether the thickness is uniform; d. Whether there is sag; e. printing with or without deviation;


Inspection method: visual inspection according to the inspection standard or inspection by means of a magnifying glass.


3) Check before reflow soldering after patching


a. the placement position of the component; b. Whether there is a drop; c. There are no wrong parts; d. with or without displacement;


Inspection method: visual inspection according to the inspection standard or inspection by means of a magnifying glass.


4) Check after reflow oven


a. Soldering of components, with or without bridging, tombstone, misalignment, solder balls, solder joints, etc. b. Solder joints.


Inspection method: visual inspection according to inspection standard or inspection by magnifying glass.


5) Plugin check


a. There are no missing parts; b. There are no wrong parts; e. the insertion of components;


Inspection method: visual inspection according to the inspection standard.


All checkpoints must be filled out with detailed and truthful reports, continuous feedback and improved factors affecting quality.


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